Standard operating procedure for Earth Pit Maintenance (SOP)

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                     PURPOSE:

1.1                   To describe standard work procedure for the maintenance of Earth pit.

                                                           

2                     SCOPE:

2.1                   This procedure is applicable for the preventive maintenance for Earth pit 

3                     REFERENCE:

3.1               maintenance Check list

3.2               IS 3043-1987

4                     Other SOPs having reference to this SOP.

4.1          Nil

4.2               Nil

5                     DEFINITION:

5.1        Nil

6                  Maintenance Procedure:

·         As per the Preventive Maintenance schedule,  Engineer informs Powerhouse and  allot Technicians

·         Get the work permit from Engineer.

·         Necessary PPE’s to be used for PM activities.

·         Check the condition of Earth resistance Meter  and it working properly

·         Arrange the two electrode  for Earth pit checking

·         Check the tightness of Connection and clean the Earth Pit

·         Connect the equipment  as per Fall of Potential method

·         Taken Earth resistance value When Grid Connected(below 2 Ohm)

·         Taken Earth Resistance value when Grid disconnected(below 5 Ohm)

·         If  Earth resistance value is low , adding water and salt in the Pit

·         After completion of the PM work, the same should be communicated to respective area Engineer

·         Fill all data in Check List

·         After the PM inform to Power House

·         This preventive maintenance will be carried out once in year  as per schedule

Download SOP

OPTICAL FIBER CABLE SPLICING

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HOW TO JOIN THE OFC 

1. Select the cable

2.Remove the outer insulation used proper tool

3.Skin the fiber 

4. clean the fiber use with spirit

5.Cut the fiber with cutter machine in proper length

6. Insert the cable in two sided with properly

7. Close the machine cover

8.start the splicing

9.After splicing the machine display indicates "remove Fiber"

10. Root the spliced fiber in Junction Box

FLEXIBLE PCB TECHNOLOGY

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Flexible-Circuit Technology

The advance of electronic systems into our everyday lives is evidence of a major digital technology revolution. The success stories of the personal computer and the mobile phone serve to demonstrate that consumer and business demand for innovative products are significant. Increasingly electrical and electronic systems are entering our lives in many unanticipated ways. They can be found in our homes in the form of cordless phones and digital TVs, in our cars in the form of hands-free communications and telematics, and in business in the form of notebook computers and mobile personal data assistants (PDAs).

Importantly, and also covertly, within the above applications flexible printed circuits have also been entering our lives. Traditionally employed in the role of wire replacement, removing the need for complex wire harnesses, and replacing costly and increasingly complicated wired assemblies, flexible circuits offer a much simpler and often significantly more cost-effective interconnection method.

 However, alongside increasingly innovative applications flexible-circuit technology is branching out significantly from this initial role and it is poised to be a technology that will provide enormous design freedoms for electronic engineers and product designers over the coming years. As the demands of modern electronic systems call for increasing functionality, greater circuit density, higher connectivity, better environmental performance, and all at lower cost, flexible circuitry is poised to deliver on the promise of twenty-first century electronics.

A Definition for Flexible Circuits

Confusion still exists regarding what constitutes a flexible circuit. When asked to envisage a flexible circuit, the image in most people’s mind will be of a bendy printed circuit, typically consisting of a flexible film with a pattern of copper conductors on it.

Whilst the image is not far from the truth, in order to better understand flexible circuits it is important at the outset to establish a working definition. The IPC (formerly the Institute for Interconnecting and Packaging Electronic Circuits), through its role of setting standards and guidelines for the electronics industry, has established such a definition:

Flexible Printed Circuit

A patterned arrangement of printed circuitry and components that utilizes flexible base material with or without flexible cover lay.

The above definition, although strictly accurate, does little justice to the complexity of the technology but does serve to convey some of the potential given the available variations in base materials, conductor materials, and protective finishes.

Flexible-Circuit Constituents

From the above definition, there are a number of basic material elements that constitute a flexible circuit: a dielectric substrate film (base material), electrical conductors (circuit traces), a protective finish (cover lay or cover coat), and, not least, adhesives to bond the various materials together. Together the above materials form a basic flexible-circuit laminate suitable for use as a simple wiring assembly, or capable after further processing of forming a compliant final circuit assembly.

Within a typical flexible-circuit construction the dielectric film forms the base layer, with adhesives used to bond the conductors to the dielectric and, in multilayer flexible circuits, to bond the individual layers together. Adhesives can also be used in a protective capacity to cover the final circuit to prevent the ingress of moisture and dirt, when they are termed ‘cover lays’ (also ‘cover layers’) or ‘cover coats’.

Materials Diversity Overview

Many individual materials exist that time and extensive prototyping have proven suitable for application in flexible circuits. There are numerous substrate materials(termed dielectrics) available as very thin films of 12–120 microns in thickness that have been prototyped as base materials upon which to build flexible circuits. However, the two most common dielectric substrate materials are polyester and polyimide. Both are widely available from a number of global sources and both have unique advantages that make them suitable as base materials.

At costs of pennies per square metre, polyester materials are used to provide millions of exceptionally low-cost flexible circuits that find their way into calculators, cameras, touch panels, keypads and automotive dashboards. Polyesters are also highly flexible and are the material of choice for dynamic flexing applications. One example is the connection between a notebook PC keyboard and its screen, an application where many thousands of flexing operations are required.

Single-Sided Flexible Circuits

Single-sided flexible circuits are the most common types of flexible circuit available. They consist of a single conductor layer on a flexible dielectric film with access to circuit-termination features accessible from one side only. They can be manufactured with or without cover lays and protective coatings, and their relatively simple design makes them highly cost effective. The conductors used can be conventional metal foil, or, for low-cost, polymer thick-film (PTF) ink can be used. This is simply printable conductive ink, loaded with carbon or silver particles, which is directly applied to the flexible substrate in the circuit pattern required by a v Single-sided circuits can offer the lowest cost and relative ease of production. Because of their thin and lightweight construction such circuits are best suited to dynamic- flexing or wiring-replacement applications such as computer printers and disk drives. Nearly all of the world’s calculators consist of PTF flexible circuits on polyester film, a combination that offers an exceptionally low circuit cost.ariety of printing and stencilling techniques.

OTDR - Optical Time Domain Reflectometer

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The architecture and the operation of the OTDR system

The OTDR is the most important investigation tool for optical fibres, which is applicable for the measurement of fibre loss, connector loss and for the determination of the exact place and the value of cabel discontinuities. By means of very short pulses it is also possible to measure the modal dispersion of multimodal fibres. The structure of a typical OTDR equipment is shown below:

The principal of the OTDR analyzer is the following: a short light pulse is transmitted into the fibre under test and the time of the incidence and the amplitude of the reflected pulses are measured. The commonly used pulse width ranges from nanosecs to microsecs, the power of the pulse can exceed 10 mW. The repetition frequency depends on the fibre length, typically is between 1 and 20 kHz, naturally it is smaller for longer fibres. The division by 2 at the inputs of oscilloscope is needed since both the vertical (loss) and the horizontal (length) scales correspond to the one-way length.

The components of the fibre loss and their importance in the OTDR measurements

There are three reasons for the fibre loss:

• absorption

• radiation loss

• Rayleigh scattering

The absorption creates 10-20% of the fibre loss. It mainly originates from the OH- ions inside the fibre material (impurities). With modern technologies the number of these contaminants, so the loss can be kept at relatively low level. The fibre loss increases dinamically for wavelengths above 1700 nm, thus this is the lowest frequency for optical telecommunications. In practice the 1300 and 1550 nm wavelengths are used as the insertion loss shows minimal values at these wavelengths. Naturally, absorption does not induce reflection, so if this would be the only physical phenomena, the fibre loss could be measured by the means of OTDR only with a well known, calibrated termination

In practice, the fibre continuously radiates backwards due to the Rayleigh scattering, which will be described later, so the absorption loss is measured together with the other losses.

Radiation loss occurs when the geometrical parameters of the fibre abruptly change, or a mechanical tension is present in the fibre material due to fabrication failure or mechanical impact. Considering appropriate fabrication technologies and fibre jacket, the radiation loss can be neglected and, like absorption, it does not create reflections, so from the OTDR measurements point of view it can handle as absorption losses. A high level discontinuity originated by e.g. strong folding, can be shown by OTDR as it produces high loss.

During OTDR measurements the most important loss is the one caused by Rayleigh scattering. It generates the 80-90% of the total loss. The scattering is induced by the microscopic inhomogenity of the refractive index of the fibre. These inhomogenities cause diffraction, so a certain part of the light energy is radiated isotropically. The level of the diffrection reaches its maximum when the wavelength is in the same range as the dimensions of the microscopic inhomogenities. Thus the level of the scattering decreases when the wavelength is increased. Among others this is the reason for using the 1300 and the 1550 nm ranges instead of the 850 nm. A certain part of the diffracted light propagates backwards in the fibre which is, when measured, carries important information. In the following, we calculate the ratio of the diffracted and the backward propagating light.